Integrity Throughout
Printed Circuit Board design and fabrication requires the physical circuit implementation to meet the electrical signal requirements. Stringent high frequency signal characteristics including amplitude, phase, slew rate, ripple, differential balance, and distortion require rigid analysis and simulation prior to design into a physical circuit board assembly.
Projects requiring SI go through an extensive customer analysis and review early in the requirements process to ensure integrity throughout the design, layout and fabrication workflow.
Signal Integrity Analysis Services:
High-frequency designs (typically >50 MHz or when signal rise times are <4× propagation delay) require: (1) Controlled impedance traces and differential pairs, (2) Proper layer stackup with power/ground planes, (3) Length matching and via management, (4) Minimized loop areas to reduce EMI, (5) Careful return path management.
Via Technology, Inc. strives to be your premier partner in electronic design engineering, offering comprehensive solutions from circuit board design and layout to software and firmware development. Our mission is to innovate and excel in creating intelligent solutions that propel our clients’ technologies forward.