Ball Grid Arrays (BGAs) are a form of surface-mount packaging suitable for integrated circuits. BGAs use the underside of integrated circuits, allowing a larger area for connections without taking as much space as other packages. At Via Technology, we utilize BGAs in coordination with our PCB design services to design superior circuit boards for a variety of applications.

What are the advantages of BGA PCB? 

Greater PCB Space Efficiency: BGA packages allow our designers to use less PCB components which creates a smaller PCB footprint. Additionally, BGAs can be used in custom PCBs for increased space efficiency. 

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Improved Thermal and Electrical Properties

With a smaller size, BGAs allow most heat transfer to occur directly to the ball grid which is ideal for heat dissipation. Also, without bendable pins in BGAs, the overall construction of the PCB becomes more durable and features better electrical performance. 

Contact Via Technology For PCB Design

If you have a product that needs custom PCBs designed for it, our engineers at Via Technology can help. We are happy to provide assistance throughout the process, from prototyping to production. Contact our team today or get a quote from our online estimator form!

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